Please use this identifier to cite or link to this item: https://scidar.kg.ac.rs/handle/123456789/14837
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dc.rights.licenseBY-NC-ND-
dc.contributor.authorOjdanić, Vasilije-
dc.contributor.authorČubonović, Stefan-
dc.contributor.authorVujičić, Vojislav-
dc.contributor.authorKoprivica, Branko-
dc.date.accessioned2022-09-12T19:35:31Z-
dc.date.available2022-09-12T19:35:31Z-
dc.date.issued2022-
dc.identifier.isbn9788677762629en_US
dc.identifier.urihttps://scidar.kg.ac.rs/handle/123456789/14837-
dc.descriptionThis study was supported by the Ministry of Education, Science and Technological Development of the Republic of Serbia, and these results are parts of the Grant No. 451-03-68/2022-14/200132 with University of Kragujevac – Faculty of Technical Sciences in Čačak.en_US
dc.description.abstractIn this paper, the construction solution and the method of programming the platform for spatial imaging with sensors are presented. The mechanical construction of the platform is described in detail, as well as the electrical components needed for movement of the sensor carrier in the horizontal plane. Movement is achieved by two stepper motors, and movement control is obtained by connecting the corresponding Arduino and LabVIEW programs. The movement of the carrier from the initial position, through four arbitrary points, until it is placed again in the initial position was realised. The paper provides relevant technical data about the platform, connection diagrams, parts of the program code and accompanying discussion.en_US
dc.language.isoenen_US
dc.publisherUniversity of Kragujevac, Faculty od Technical Sciences, Čačaken_US
dc.rightsopenAccess-
dc.rights.urihttps://creativecommons.org/licenses/by-nc-nd/4.0/-
dc.sourceProceedings TIE 2022 9th International Scientific Conference Technics and Informatics in Educationen_US
dc.subjectplatform spatial imaging with sensorsen_US
dc.subjectmechanical constructionen_US
dc.subjectelectrical componentsen_US
dc.subjectArduinoen_US
dc.subjectLabVIEWen_US
dc.titleConstruction and programming of the platform for spatial imaging with sensorsen_US
dc.typeconferenceObjecten_US
dc.description.versionPublisheden_US
dc.identifier.doi10.46793/TIE22.159Oen_US
dc.relation.conference“Technics and Informatics in Education – TIE 2022”en_US
dc.type.versionPublishedVersionen_US
Appears in Collections:Faculty of Technical Sciences, Čačak

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