Please use this identifier to cite or link to this item: https://scidar.kg.ac.rs/handle/123456789/9823
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dc.contributor.authorMinic D.-
dc.contributor.authorKolarevic, Milan-
dc.contributor.authorManasijevic D.-
dc.contributor.authorĆosović V.-
dc.contributor.authorŽivković D.-
dc.contributor.authorTalijan N.-
dc.contributor.authorMarkovic M.-
dc.date.accessioned2021-04-20T14:08:55Z-
dc.date.available2021-04-20T14:08:55Z-
dc.date.issued2012-
dc.identifier.issn0334-6455-
dc.identifier.urihttps://scidar.kg.ac.rs/handle/123456789/9823-
dc.description.abstractGiven that Sn-based lead-free solders are considered as possible substitution for standard lead-tin solders, properties of the alloys from ternary Bi-Sb-Sn system were characterized by microstructural SEM-EDS analysis, Brinell hardness tests, and electrical conductivity measurements. Isothermal cross section at 298 K and liquidus surface projection were calculated by application of CALPHAD method and software package PANDAT 8.1. The experimentally determined phase compositions in analyzed microstructures were found to be in a good agreement with phases on calculated cross sections. Copyright © 2012 De Gruyter.-
dc.rightsrestrictedAccess-
dc.sourceHigh Temperature Materials and Processes-
dc.titleCharacterization of alloys and liquidus projections of ternary Bi-Sb-Sn system-
dc.typearticle-
dc.identifier.doi10.1515/htmp.2011.124-
dc.identifier.scopus2-s2.0-84860129419-
Appears in Collections:Faculty of Mechanical and Civil Engineering, Kraljevo

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